Morgan Advanced Materials Announces Min-K® Microporous Insulation with Exceptional Thermal Management Performance for Demanding Rail Applications


Morgan originally developed its patented Min-K® 1303 endothermic microporous insulation material for crash hardened memory modules and event recorders.  Min-K contains a raw material that absorbs a portion of the energy from a fire or sudden temperature rise, thereby delaying heat transfer to the inside. This endothermic effect, in combination with the properties of Min-K® microporous insulation, provides superior insulation as part of an overall system. The endothermic microporous material is typically pressed or molded and then machined to close dimensional tolerances, to provide a crash worthy housing for the event recorder.

For applications that require a material that can cycle between high and low temperatures, Min-K® 2000 offers low thermal conductivity insulation that can be molded and/or machined to shape. This material is a good choice for use in data recorders and to produce tight tolerance board insulation.

Also available is Flexible Min-K®, a composite system consisting of a microporous core encapsulated between layers of high temperature cloth and quilted in 1-inch (2.5 cm) squares. The quilting maintains core distribution in high vibration environments and allows the insulation to be wrapped or bent to conform to unique geometric shapes during installation.

Min-K® composite, a combination of flexible Min-K® microporous insulation with K-Shield® Felt AG or K-Shield BF Paper, offers the low thermal conductivity of microporous insulation with the high temperature-use limit of ceramic fiber felts and papers, resulting in a lighter weight, lower cost product with improved flexibility and good sound absorption at different frequencies. Min-K® microporous insulation is a good option for hard-to-insulate areas, where weight is critical and working space is minimal.

For more information, please visit:

Morgan Thermal Ceramics,
Morgan Advanced Materials,